Shenzhen Hongwei High Frequency Technology Co., Ltd.
We design and build Blister Thermoforming, Sealing and Packing Equipment as per client's requirement based on the conditions of product to Optimize Production for Lower Cost and Higher Productivity
Model HW-TBP500A Rating Output 12-15 Punch/Minute, 12 pcs/Stroke Assembly Dimensions 7500*780*1900mm Net weight Appropriate 2.5T Molding Area 250*420 mm Ambient Temperature 18~30℃ Power Supply 3...